Technical information

Developing Porous Copper Sintered FoilResearch and Development of Metal Powder and Foil

FUKUDA has developed porous copper sintered foil.

About Porous Copper Sintered Foil

  • There are micron-sized voids that communicate three-dimensionally, and fluid movement in the foil is possible due to capillary action.
  • There is a possibility of use in the field of heat dissipation measures.
  • Please contact us for surface treatment.

Example Specifications

Thichness 100 μm, Porosity 30 %

Inquiries and requests for small samples are welcome.