A sub-micron level ultra fine roughening process, which has minimal effect on roughness, provides high adhesion strength even at ultra-low roughness levels. Microparticle adhesion is also very high, which ensures reliable operation without line contamination due to roughening particles becoming falling loose.
Product Categories | Metal Foils Metal Foils > Copper Foils Metal Foils > Copper Foils > RA Copper Foils |
---|---|
Main Applications | Electronics Electronics > EMI shielding Electronics > Electronic parts (conductor materials) Electronics > Electronic parts (conductor materials) > Circuit conductors Electronics > Printed circuit boards Electronics > Printed circuit boards > Flexible circuit boards Electronics > Printed circuit boards > Rigid circuit boards |
Main ingredients | Cu (copper) |
Shape | Rolled |
Features |
This surface treated rolled copper foil is suitable for use in both two-layer and three-layer flexible circuit boards. |