In addition to offering carrier foil thicknesses up to 70 µm, standard or low peel strengths, and ultra-thin copper foil thicknesses from 1.5 µm to over 10 µm, surface treatment technologies from profile-free to fine-roughened particles are available. As a result, foils in this series are able to satisfy requirements that were impossible in the past.
| Product Categories | Metal Foils Metal Foils > Copper Foils Metal Foils > Copper Foils > Ultra-Thin Foils |
|---|---|
| Main Applications | Electronics Electronics > EMI shielding Electronics > Electronic parts (conductor materials) Electronics > Electronic parts (conductor materials) > Circuit conductors Electronics > Printed circuit boards Electronics > Printed circuit boards > Flexible circuit boards Electronics > Printed circuit boards > Rigid circuit boards |
| Main ingredients | Cu (copper) |
| Shape | With carrier Rolled Sheets |
| Features |
An extensive selection of carrier foils, peel strengths, and ultra-thin copper foils can be combined to achieve unprecedented product compositions. |