FUKUDA's proprietary ultra low roughness treatment process ensures effective adhesion strength for low Dk film materials, for which adhesion strength is difficult to achieve, without sacrificing transmission properties. Due to the recrystallized base foil, it also offers superior bending characteristics for contributing to the next generation of flexible printed circuits.
| Product Categories | Metal Foils Metal Foils > Copper Foils Metal Foils > Copper Foils > ED Copper Foils |
|---|---|
| Main Applications | Electronics Electronics > EMI shielding Electronics > Electronic parts (conductor materials) Electronics > Electronic parts (conductor materials) > Circuit conductors Electronics > Printed circuit boards Electronics > Printed circuit boards > Flexible circuit boards |
| Main ingredients | Cu (copper) |
| Shape | Rolled Sheets |
| Features |
This ED copper foil is designed specifically for flexible high speed transmission circuit boards. It provides high adhesion strength without sacrificing transmission properties, even for film materials with low dielectric constants. |