The raw foil [SV], which has a glossy surface with ultra low roughness on both sides, is treated with FUKUDA's proprietary micro-roughening process [T4X] to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.
| Product Categories | Metal Foils Metal Foils > Copper Foils Metal Foils > Copper Foils > ED Copper Foils |
|---|---|
| Main Applications | Electronics Electronics > EMI shielding Electronics > Electronic parts (conductor materials) Electronics > Electronic parts (conductor materials) > Circuit conductors Electronics > Printed circuit boards Electronics > Printed circuit boards > Flexible circuit boards Electronics > Printed circuit boards > Rigid circuit boards |
| Main ingredients | Cu (copper) |
| Shape | Rolled Sheets |
| Features |
A wide selection of thicknesses is available, from a minimum thickness of 6 µm up to 35 µm. It features the lowest profile level available for roughened ED copper foils. |