Due to a proprietary crystallization control process, this ED copper foil can be recrystallized after heating. The HD series boasts bendability equivalent to tough-pitch copper after recrystallization.
| Product Categories | Metal Foils Metal Foils > Copper Foils Metal Foils > Copper Foils > ED Copper Foils |
|---|---|
| Main Applications | Electronics > EMI shielding Electronics > Electronic parts (conductor materials) Electronics > Electronic parts (conductor materials) > Circuit conductors Electronics > Printed circuit boards Electronics > Printed circuit boards > Flexible circuit boards |
| Main ingredients | Cu (copper) |
| Shape | Rolled |
| Features |
The foil offers both the high bendability and ultra low roughness equivalent to tough-pitch copper. This ED copper foil can be used as a substitute for rolled copper foil. |