This high-temperature high-elongation foil is intended for IPC grade 3 rigid boards.
The UN series increases the sharpness of the nodules on the matte side of the raw copper foil to increase the gap size between nodules and achieve a smoother resin flow.
The HS series is available in 9 µm or 12 µm thicknesses and is easier to handle.
In addition to outer layers, this foil is also suitable for use as an inner layer for CCL, BU, or other boards.
| Product Categories | Metal Foils Metal Foils > Copper Foils Metal Foils > Copper Foils > ED Copper Foils |
|---|---|
| Main Applications | Electronics > EMI shielding Electronics > Electronic parts (conductor materials) Electronics > Electronic parts (conductor materials) > Circuit conductors Electronics > Printed circuit boards Electronics > Printed circuit boards > Flexible circuit boards Electronics > Printed circuit boards > Rigid circuit boards |
| Main ingredients | Cu (copper) |
| Shape | Rolled Sheets |
| Features |
This ED foil offers broad applicability and is suitable for use as either an outer or inner layers for rigid boards. |