The STD series is an IPC grade 1 copper foil intended for use as the outer layer of rigid boards. It is available in thicknesses ranging from a minimum 12 µm to a maximum ED copper foil thickness of 140 µm. This is the only ED copper foil available in the 105 µm and 140 µm thicknesses, making it ideal for boards designed as heat sinks or to conduct large electrical currents.
| Product Categories | Metal Foils Metal Foils > Copper Foils Metal Foils > Copper Foils > ED Copper Foils |
|---|---|
| Main Applications | Electronics > EMI shielding Electronics > Electronic parts (conductor materials) Electronics > Electronic parts (conductor materials) > Circuit conductors Electronics > Printed circuit boards Electronics > Printed circuit boards > Flexible circuit boards Electronics > Printed circuit boards > Rigid circuit boards |
| Main ingredients | Cu (copper) |
| Shape | Rolled Sheets |
| Features |
This is our standard ED copper foil product with the longest history of use as an outer layer for rigid boards. |