Copper flake powder and silver flake powder are made by pulverizing the spherical fine powder "HWQ" produced by ultra high pressure swirling water.
| Product Categories | Metal Powders > Stamped (Pulverized) Powders Metal Powders > Ultra High Pressure Swirl Water Atomized Powders |
|---|---|
| Main Applications | Energy > Capacitors Energy > Power generation equipment > Conductive materials Electronics > Electronic parts (conductor materials) Electronics > Electronic parts (conductor materials) > Circuit conductors Electronics > Electronic parts (conductor materials) > Capacitors Electronics > Electronic parts (conductor materials) > Films Electronics > Electronic parts (conductor materials) > Pastes Automobiles > Conductive materials |
| Main ingredients | Cu (copper) Ag (silver) |
| Manufacturing method | Pulverizing Water atomization |
| Shape | Flaked |
| Features |
This powder was developed for materials used to make increasingly smaller and thinner electronic parts. The flake shape significantly increases the contact surface between powder particles, which helps to improve conductivity. |
| Grade | 50%-Diameter (μm) |
Tap Density (g/cm3) |
Specific Surface Area (m2/g) |
|---|---|---|---|
| Cu-HWF-2L | 2.0 | 4.6 |
0.73 |
| Cu-HWF-3L | 2.9 | 4.6 |
0.70 |
| Cu-HWF-3H | 2.9 | 2.9 | 1.12 |
| Cu-HWF-6L | 6.0 | 5.1 | 0.31 |
| Cu-HWF-6H | 5.8 | 3.5 | 0.85 |
| Ag-HWF-6 | 6.1 | 6.5 | 0.17 |
All figures shown above are typical values and are not guaranteed.Properties may be changed without advanced notice.