This copper powder is in the form of flakes. A high aspect ratio is achieved using FUKUDA's unique stamp milling technology. In spite of their thinness, the flakes offer superior coverage performance for use in a wide variety of applications.
| Product Categories | Metal Powders > Stamped (Pulverized) Powders |
|---|---|
| Main Applications | Energy > Capacitors Energy > Power generation equipment > Conductive materials Electronics > Electronic parts (conductor materials) Electronics > Electronic parts (conductor materials) > Circuit conductors Electronics > Electronic parts (conductor materials) > Capacitors Electronics > Electronic parts (conductor materials) > Films Electronics > Electronic parts (conductor materials) > Pastes Daily Living > Paints and printing inks Automobiles > Conductive materials |
| Main ingredients | Cu (copper) |
| Manufacturing method | Pulverizing Stamp milling |
| Shape | Flaked |
| Features |
●Ultra thin flake copper powder with high aspect ratio and low apparent density. |
Standard Flake Copper series
| Grade |
Composition |
Apparent Density |
Particle Size Distribution (mass %) |
||
|---|---|---|---|---|---|
| (g/cm3) | +75μm | +45μm | -45μm | ||
| MS-800 | Cu100 | 0.6 -1.0 | <4 | <25 | >75 |
| Cu-S -100 | Cu100 | 0.9 -1.3 | - | <35 | >65 |
| E 3 | Cu100 | 0.9 -1.7 | <3 | <40 | >60 |
*All data and figures shown above are typical values and are not guaranteed. All content is subject to change without advance notice.
Ultra Thin Flake Copper series [nanoThin]
| Grade |
Composition |
Apparent Density |
Particle Size Distribution (mass %) |
50%-Diameter |
BET Specific Surface Area |
|---|---|---|---|---|---|
| (g/cm3) | (-45μm) | (μm) | (m2/g) | ||
| CuX-4 | Cu100 | 0.9 | 100 | 3.8 | 2.4 |
| CuX-5N | Cu100 | 0.7 | 100 | 4.0 | 2.9 |
| CuX-6N | Cu100 | 0.7 | 100 | 6.2 | 2.2 |
| CuX-6 | Cu100 | 0.8 | 100 | 6.3 | 2.1 |
| CuX-7 | Cu100 | 0.7 | 100 | 7.0 | 2.1 |
*All data and figures shown above are typical values and are not guaranteed. All content is subject to change without advance notice.
Examples of Use in the Electronic Materials
Application is Printed Electronics
Our flake copper powder provides high conductivity in the field of printed electronics, where circuit wiring is formed by printing.
Printed Electronics Using our Flake Copper Powder
Advantages of Using Ultra Thin Flake Copper Powder
With spherical or granular fine copper powder, cracks easily occur due to film shrinkage during firing, making it difficult to obtain adhesion strength and conductivity with the substrate.
Ultra thin flake copper powder allows the coated film to shrink in the plane direction (horizontal direction in the figure), reducing the risk of breaking and thereby enhancing adhesion strength and conductivity.
Image of Conductive Film Cross Section
Image of Comparison Using our Materials
Conductivity Data
|
Grade |
50%-Diameter | BET Specific Surface Area | Volume Resistivity |
|---|---|---|---|
| （μm） | （m2/g） | (Ω・cm) | |
| CuX-4 | 3.8 | 2.4 | 3.3×10-5 |
| CuX-5N | 4.0 | 2.9 | 5.6×10-5 |
| CuX-6N | 6.2 | 2.2 | 7.3×10-5 |
| CuX-6 | 6.3 | 2.1 | 5.0×10-5 |
| CuX-7 | 7.0 | 2.1 | 5.5×10-5 |
*Conductive Film Thickness After Firing = Approx. 10-20 μm
*All data and figures shown above are typical values and are not guaranteed. All content is subject to change without advance notice.
Fabrication Conditions for Conductive Films
1) Paste (Flake Copper Powder + Resin + Solvent) Copper Content After Curing = 90 wt%
2) Print on Substrate (Glass)
3) Firing 275 °C x 60 min Nitrogen Atmosphere
Conductive Film After Firing (Example)
Wet Film After Printing
Conductive Film After Firing
