Product Information

Lead-Free Solder Ball

These spherical metal balls are manufactured by spraying uniform droplets of molten metal within an inert gas environment.

Product Categories Metal Powders > Metal Balls
Main Applications Energy > Power generation equipment > Conductive materials Electronics > Electronic parts (conductor materials) Electronics > Electronic parts (conductor materials) > Bonding materials Automobiles > Conductive materials
Main ingredients Cu (copper) Ag (silver) Sn (tin)
Manufacturing method Uniform droplet spraying (metal balls)
Shape Spherical
Features

These balls offer superior sphericity and size uniformity, with minimal surface oxidation. Balls can be manufactured in sizes ranging from 80 to 760 µm. A wide variety of compositions are available. Contact a FUKUDA representative for more details.

Grade Composition
(mass%)

Melting Temp.
(℃)

Specific Gravity
(g/cm3)

Sn Ag Cu Bi Au
FBM-Sn3.5Ag Bal. 3.5       221 7.36
FBM-Sn3Ag0.5Cu Bal. 3 0.5    

217-219

7.4
FBM-Sn58Bi Bal.     58   139 8.7
FBM-SN100C *1 *2        

*3

*4
FBM-Au20Sn Bal.       20 280 14.52
FBM-Au90Sn Bal.       90 217 7.78

All figures shown above are typical ones, not guaranteed ones. Properties may be changed without advanced notice.

 

Diameter Tolerance
80-300µm ±10µm
350-450µm ±10µm
500-760µm ±20µm

※1 SN100C(SnCu Series):Product name of NIHON SUPERIOR

※2,3,4 Conforming to spec of SN100C

Please ask us to manufacture for the other compositions, particle diameter and tolerance.

The particle diameter which we can manufacture depends on Grade. Please ask us detail.

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