These metal balls consist of copper balls, which offer superior sphericity and size uniformity, as the core material. They are coated with lead-free solder.
| Product Categories | Metal Powders > Metal Balls |
|---|---|
| Main Applications | Energy > Power generation equipment > Conductive materials Electronics > Electronic parts (conductor materials) Electronics > Electronic parts (conductor materials) > Bonding materials Automobiles > Conductive materials |
| Main ingredients | Cu (copper) Ag (silver) Sn (tin) |
| Manufacturing method | Uniform droplet spraying (metal balls) |
| Shape | Spherical |
| Features |
The size of Cu balls can be selected from particle diameters ranging from 80 to 760 µm. Offering superior strength, they are suitable for use in ensuring clearances in semiconductor packages. A wide variety of plating thicknesses and compositions are also available. Contact a FUKUDA representative for more details. |
| Cu Ball Particle Diameter | 80～760µm |
|---|---|
| Plating Composition | Sn, Sn-Ag, Sn-Ag-Cu,Sn-Bi, Sn-Cu, Ag-Cu |
* Contact a FUKUDA representative for plating thickness.