News

A presentation on "Evaluation of Copper Foil for High-Speed Transmission Lines Using Resonators" will be held at JIEP. NewsTechnical information November 11, 2025

Date of presentation  December 10, 2025
Name and Venue of presentation 2025 3rd Open Research Meeting / KAIRO-KAIKAN B1F Conference Room
*Hybrid meeting
Title of presentation Evaluation of Copper Foil for High-speed Transmission Lines Using Resonators
*Presentation in Japanese
Organization name (name of academic society, etc.) Device Embedded Substrate Technology Commitee, The Japan Institute of Electronics Packaging (JIEP)
URL https://jiep.or.jp/tech-committees/pdf/20251210.pdf