News
A presentation on "Copper Foil Technology for High performance Printed Circuit Board" will be held at JIEP Symposium. NewsTechnical information May 20, 2025
| Date of presentation | June 5, 2025 |
| Venue of presentation | JIEP Symposium B, Tokyo Big Sight |
| Title of presentation | Copper Foil Technology for High performance Printed Circuit Board |
| Organization name (name of academic society, etc.) | The Japan Institute of Electronics Packaging |
| URL | https://jpca2025.tems-system.com/eguide/jp/sem/jiep/seminar_details/788JokaNPaU#A29157368 |